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Duration: half day Today's electronic equipment continues to challenge the designer's ingenuity to assemble electronic components into the smallest geometries possible. Coupled with the need for appropriate land patterns and smaller geometries are the density factors that impact the positioning of components and conductors required to interconnect the electronic signals. Designers need a strong background in components, fabrication test and assembly processes to meet all the challenges of miniaturization. IPC-SM-782A, Surface Mount Design and Land Pattern Standard, is the sole industry consensus document on SMT design. It provides appropriate sizes, shapes, and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillets, while still permitting inspection and testing of those solder joints. This workshop discusses the principles behind good land pattern design to achieve cost, performance, reliability, and density goals. Attendees will have the opportunity to fully understand the current web based land pattern calculator, as well as preview the soon to be released update to that calculator. Also highlighted is a detailed discussion on the next revision of the IPC-SM-782. This revision-in-work takes the land patterns to the next generation, addressing three levels of density. Standard SMT, fine
pitch SMT, and BGA technologies are included in the discussions.
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